Shijiazhuang FC Electronic Technology Co., Ltd
China
| Electronic components, modules and subsystems | PCBs Semiconductor Components Assemblies & Modules Electromechanics Components & Cases for Devices Electronic Design and Manufacturing |
Pavilion 3 Hall 14
Stand No- C9173
Shijiazhuang Fengce Electronic Technology Co., Ltd. was established in 2022. Its core team has been engaged in semiconductor work for over 20 years and is a key enterprise in the high-performance ceramic SIP industry chain in Shijiazhuang. The company focuses on the research, development, and production of ceramic thick and thin film processes, as well as advanced packaging of digital SIP modules.
Thick and thin film technology products mainly include: filters, microwave dielectric ceramics, PTC thermistor components, electronic ceramic tubes, ceramic IPD passive device integration, ceramic interposers, ceramic heat sinks, ceramic high-density carrier boards, etc. The substrate materials include aluminum oxide, aluminum nitride, silicon nitride, silicon carbide, diamond copper, etc., and we have production capabilities for HTCC, DPC, and TCV processes.
Advanced packaging technology capabilities include: solder pad SOP, FC chip placement, WB gold wire bonding, deep cavity paste dispensing, underfill glue bottom filling, SMT device surface mounting, injection molding, hermetic sealing cap, ball placement and pillar placement, and other technical processes. These capabilities enable the production of products such as QFN, BGA, LGA, CCGA, etc. The products are primarily SIP modules for RF communication, power supply, computing, and AI chips.
| Featured Brochure Image | Brochure Name | Brochure PDF |
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Shijiazhuang FC Electronic Technology2026 | |
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FILTER | |
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led module and light |
Filters, microwave dielectric ceramics, PTC thermistor components, electronic ceramic packages, ceramic IPD passive device integration, ceramic interposers, ceramic heat sinks, ceramic high-density carrier boards. SIP modules for RF communication, power supply, computing, and AI chips. LED modules.