| Other | - |
| Electronic components, modules and subsystems | Semiconductor Components |
Scope of Business:
manufacturing, sales of dicing saw equipment,dicing blade & grinding wheel, diamond & CBN superabrasive tools, technical service.
Main Products:
dicing saw machine、other auxiliary tool(chuck table, dressing board, dicing blade( resin&metal),back grinding wheel,optical fiber grinding wheel etc.
| Featured Brochure Image | Brochure Name | Brochure PDF |
|---|---|---|
|
dicing saw machine and chuck table | |
|
IC chip grinding and dicing solution |
Metal & Resin Diamond Dicing Blade
Porous Ceramic Metal Chuck Table
Silicon Wafer Perimeter Blades used for Bonded Die Edge Trimming
Sapphire Thinning Grinding Wheel
Silicon Wafer Back Grinding Wheels
Solar Photovoltaic Grinding Wheel
Dicing Saw
Film Machine for Wafer
Resin & Ceramic Dresser Board
Diamond Dicing Blade
Long Life R15C Series Silicon Wafer Perimeter Blades used for Bonded Die Edge Trimming