Beijing Integrichip Technology Co.,Ltd
China
| IT and Digital solutions | Equipment, solutions and services for telecommunications |
| Technologies, equipment and materials for electronic manufacturing | Electronics and Electronic Components Manufacturing Equipment Materials used in the Electronics, Microelectronics and Components Manufacturing Microelectronics Equipment Printed Circuit Boards (PCB) Manufacturing Equipment Testing and Measuring Equipment for Electronic Components and Systems |
| Electronic components, modules and subsystems | PCBs Power Electronics Semiconductor Components Sensors and control devices |
Pavilion 3 Hall 14
Stand No- C7111
Beijing Integrichip Technology Co.,Ltd . is headquartered in Beijing, with branches in Chongqing, Hong Kong and Suzhou, responsible for wafer foundry, chip procurement, and wafer-level and system-level test verification respectively. The company focuses on R&D and manufacturing of customized microsystem products, employing over 40 staff. Its core team has over 20 years of experience in aerospace, weaponry, automotive electronics, servers and other fields.
Adhering to the philosophy of "Precision in Core, Integration & Innovation, Persistent Execution, Joint Excellence", it strives to provide customized, high-performance, small-size and low-cost solutions, aiming to become a leading domestic and world-class microsystem integration solution and product supplier. It has obtained ISO9001 quality management system certification.
Core capabilities include packaging design, integrated manufacturing and test verification. Packaging design boasts multi-physics field coupling platforms, supporting full-process customization. Its high-speed signal SIPI simulation leads the industry, with cost optimization via multi-dimensional simplification. Integrated manufacturing covers conventional, advanced and special processes. Conventional packaging has substantial annual capacity, meeting multi-level quality requirements; advanced processes include MCM, Fan-out, CoWoS and 3D stacking for high-density integration. The full-process test verification system features multi-physics simulation and dynamic DFT design.
