| Technologies, equipment and materials for electronic manufacturing | Electronics and Electronic Components Manufacturing Equipment |
The scientific and production company STEP traces its history back to the 1980s, specifically to a laboratory at one of Saint Petersburg's research institutes.
Adhesives developed by the laboratory's specialists at that time found demand in the rocket and space, nuclear, aviation, shipbuilding, and other industrial sectors. Some of these materials are still produced today, retaining all their original properties. Over recent years, a new generation of leading employees has taken over, blending the classical academic school with modern innovative approaches to materials science and formulation development. Our clients include hundreds of machine-building and instrument-making enterprises across Russia. In recent years, we've also tackled challenges in diverse fields such as construction, electrical engineering, nuclear industry, and energy.
We produce advanced epoxy-rubber, polyurethane, and silicone adhesives, compounds, and sealants of our own design. We pay special attention to the availability of raw material components and reducing production costs, which enables us to offer competitive prices. Today, STEP Scientific and Production Company is a state-of-the-art complex spanning over 1,400 m², staffed with qualified specialists and equipped with modern production and laboratory facilities. A major boost to the company's development came from efforts to replace imported materials that disappeared from the market due to recent events.
Modern, user-friendly, and easy-to-apply electrical removable compounds for enhancing junction box protection to IP-68 rating – STEP-M1, STEP-M2, and STEP-M3 compounds.
Versatile epoxy repair compound STEP-5. This is a two-component epoxy rubber adhesive sealant that cures at room temperature and is modified with thiokol rubber. It is designed for repair work, structural bonding, fixing ERI components, and use as a non-removable sealant.
Frost-resistant epoxy rubber compound STEP-K337 with cold curing. The material retains moderate elasticity down to -60°C, features high physico-mechanical properties, and a high modulus of elasticity. It can be used for spark-proof electronic connections in devices.
Foam compound STEP-K510 with a density of 0.3 g/cm³. Despite its low density, the material offers high structural strength, making it ideal for critical assemblies where reinforcing the structure while keeping product weight low is essential. Foaming occurs within the first 10 minutes after mixing components. The compound is intended to increase payload capacity.