| Technologies, equipment and materials for electronic manufacturing | Electronics and Electronic Components Manufacturing Equipment Materials used in the Electronics, Microelectronics and Components Manufacturing |
| Electronic components, modules and subsystems | Passive Components PCBs Power Electronics Sensors and control devices Electromechanics Components & Cases for Devices |
| Robotics & AI | Technologies and components for robotics |
«С-Component» provides a full-cycle production of high-tech ceramic components and electronic assemblies, ranging from material development to the final assembly of hybrid circuits.
MATERIALS
• Ceramics: Al₂O₃ (grades VK-94, VK-96, VK-100), AlN, Si₃N₄
• Specialty Materials: Fused Silica (Quartz), Lithium Niobate (LiNbO₃), Lithium Tantalate (LiTaO₃)
TECHNOLOGIES
• Processing: Precision laser & diamond machining, grinding, and polishing
• Metallization: Thin-film & Thick-film deposition, DBC (Direct Bonded Copper), AMB (Active Metal Brazing)
• Assembly: PCBA (PCB Assembly) and complex hybrid microcircuit assembly
PRODUCT RANGE
• Ceramic PCBs and substrates with custom geometries
• IC packages, chip carriers, RF/Microwave terminations (loads)
• Piezoelectric elements, sensors, resistive components
• Thermally conductive pads, potting compounds, and thermal pastes